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多功能全自動(dòng)芯片貼片固晶機(jī) TB-1000針對(duì)高標(biāo)準(zhǔn)的芯片貼裝應(yīng)用，提供高技術(shù)力的多功能貼片固晶系統(tǒng)以及高底定制化的方案服務(wù)，尤其是對(duì)于超薄存儲(chǔ)芯片的堆疊裝片具有突出表現(xiàn)。

芯片分選機(jī),精密倒裝芯片貼片機(jī) CB-610特點(diǎn)：$n Correspond to fine pitch of electrodes with mounting accuracy ± 1μm$n Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement

超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn)： ? Ultra-low load, high-accuracy bonding ? Real-time control is possible in the low load range. As a result, bump height variation become minimized.